1. Enhanced Efficiency
When compared to a typical double-chamber laminating machine, this equipment boasts a single machine productivity that is 3.6 times higher than that of a standard single-chamber laminating machine. For instance, using 72 pieces of 330W components measuring 156×156 in size, made of ordinary silicon wafer, and assuming continuous operation for 24 hours a day, 300 days a year, with 4 components pressed in each furnace cycle, the annual output of a single machine can reach 152MW.
2. Compact Design
With the same capacity as a regular double-cavity laminating machine, this equipment takes up only half the space, saving valuable factory real estate and reducing production costs. Additionally, the equipment is more streamlined, requiring fewer operators and thus cutting down on labor expenses.
3. Fully Automated
Featuring a 4-chamber design with upper and lower layers, automatic feeding, and intelligent control, this equipment can seamlessly integrate with a fully automated production line. 4. Simple Maintenance
The design of the internal structure makes it easy for maintenance and operation personnel to check equipment status and identify any issues. It also allows for easy replacement of wearing and consumable parts due to the simple frame structure.
5. Energy Efficient
The equipment is heated by two heating stations on the upper and lower floors, reducing energy consumption and saving costs for users.
6. Versatile
This equipment can be used for packaging various types of solar modules, including single crystal, polycrystalline silicon, and thin film double glass modules. It is suitable for both industrial and laboratory environments.
7. Versatility
Each chamber layer is designed independently with its own vacuum and pressure system. The two-layer chamber can work together with a lifting transmission platform or independently. If one layer needs maintenance, it will not affect the operation of the other layer.
8. Safety
The materials used in manufacturing the equipment are non-toxic and safe for use.
9. Establishing the Thimble System Based on Requirements. | 
